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覆铜板-----又名基材。

CCL-----Also known as the base material.

覆铜板，全称覆铜板层压板，是由木浆纸或玻纤布等作增强材料，浸以树脂，单面或双面覆以铜箔，经热压而成的一种产品。 当它用于多层板生产时，也叫芯板。

CCL (Copper Clad Laminate)  consists of wood pulp paper or glass fiber cloth as reinforcing materials with resin, and single or double-sided coated with copper foil, and laminated under high temperature and high pressure. It is also called a core plate when it is used for multilayer board production.

目前，市场上供应的覆铜板，从基材考虑，主要可分以下几类：纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板。

At present, CCL supplied on the market can be divided into the following main categories based on the base materials: paper plate, fiberglass cloth plate, synthetic fiber cloth plate, non-woven plate, composite plate.

基板是由高分子合成树脂和增强材料组成的绝缘层板;在基板的表面覆盖着一层导电率较高、焊接性良好的纯铜箔，常用厚度35～50/ma;铜箔覆盖在基板一面的覆铜板称为单面覆铜板，基板的两面均覆盖铜箔的覆铜板称双面覆铜板;铜箔能否牢固地覆在基板上，则由粘合剂来完成。常用覆铜板的厚度有1.0mm、1.5mm和2.0mm三种。

The substrate is insulating layer board composed of polymer resin and reinforced material. the surface of the substrate is covered with copper foil with a high conductivity and good weldability. The copper foil’s thickness commonly is 35~50/ma. The single-sided CCL means that the copper foil cover one side of the base plate, and CCL that two sides of the base plate cover copper foil is called double-sided CCL. Whether the copper foil can be firmly attached to the substrate depends on the binder. The thickness of the common CCL is 1.0mm, 1.5mm and 2.0mm.

覆铜板常用的有以下几种

 

FR-1 ──酚醛棉纸，这基材通称电木板(比FR-2较高经济性)

FR-2 ──酚醛棉纸

FR-3 ──棉纸(Cotton paper)、环氧树脂

FR-4──玻璃布(Woven glass)、环氧树脂

FR-5 ──玻璃布、环氧树脂

FR-6 ──毛面玻璃、聚酯

G-10 ──玻璃布、环氧树脂

CEM-1 ──棉纸、环氧树脂(阻燃)

CEM-2 ──棉纸、环氧树脂(非阻燃)

CEM-3 ──玻璃布、环氧树脂

CEM-4 ──玻璃布、环氧树脂

CEM-5 ──玻璃布、多元酯

AIN ──氮化铝

SIC ──碳化硅

The Common CCL:

FR-1 ── Phenolic potton paper, the base material commonly known as Bakelite (higher performance-price ratio than FR-2)

FR-2── phenolic cotton paper

FR-3── cotton paper, Epoxy

FR-4──woven glass, epoxy resin

FR-5── Glass cloth, Epoxy resin

FR -6── glass, polyester

G-10── glass cloth, epoxy

CEM-1── cotton paper, epoxy resin (flame retardant)

CEM-2── cotton paper, epoxy resin (non-flame retardant)

CEM-3── glass cloth, epoxy resin

CEM-4── glass cloth, epoxy resin

CEM-5──Glass cloth, multi-ester

AIN── aluminum nitride

SIC── silicon carbide

覆铜板的种类也较多。按绝缘材料不同可分为纸基板、玻璃布基板和合成纤维板;按粘结剂树脂不同又分为酚醛、环氧、聚脂和聚四氟乙烯等;按用途可分为通用型和特殊型。

There are also more types of CCL. According to different insulating materials, they can be divided into paper plate, glass cloth and synthetic fiber board; According to the binder resin, they can be divided into phenolic, epoxy, polyester and PTFE, etc.; According to the usage, they can be divided into general-purpose and special type.

常用覆铜板的结构及特点

Structure and characteristics of common CCL

(1)覆铜箔酚醛纸层压板 是由绝缘浸渍纸(TFz一62)或棉纤维浸渍纸(1TZ-一63)浸以酚醛树脂经热压而成的层压制品，两表面胶纸可附以单张无碱玻璃浸胶布，其一面敷以铜箔。主要用作无线电设备中的印制电路板。

(1) Phenolic paper copper-clad laminate uses insulating impregnated paper (TFZ 162) or cotton impregnated paper (1tz-163) impregnated with phenolic resin, and laminated thermally. Two-side gummed paper can be attached to a single sheet of alkali-free glass dipping tape, the other side attached to copper foil which is mainly used as printed circuit board in radio equipment.

(2)覆铜箔酚醛玻璃布层压板 是用无碱玻璃布浸以环氧酚醛树脂经热压而成的层压制品，其一面或双面敷以铜箔，具有质轻、电气和机械性能良好、加工方便等优点。其板面呈淡黄色，若用三氰二胺作固化剂，则板面呈淡绿色，具有良好的透明度。主要在工作温度和工作频率较高的无线电设备中用作印制电路板。

(2) Phenolic glass cloth Copper-clad laminate uses alkali-free glass cloth impregnated with epoxy resin , and laminated thermally. Its single or double-sided coated with copper foil. And it has  light weight, good electrical and mechanical properties, convenient processing and other advantages. Its plate is light yellow. If we used cyanuric diamine as a curing agent, the plate is light green, and has good transparency. It is mainly used as printed circuit board in radio equipment that operate frequently in high temperature.

(3)覆铜箔聚四氟乙烯层压板 是以聚四氟乙烯板为基板，敷以铜箔经热压而成的一种敷铜板。主要用于高频和超高频线路中作印制板用。

(3) PTFE copper clad laminate is based on PTFE board, attached to copper foil by hot pressing, which is mainly used in high frequency and UHF circuits for printed boards.

(4)覆铜箔环氧玻璃布层压板 是孔金属化印制板常用的材料。

(4) Epoxy glass cloth copper clad laminate is a commonly material for perforated metallized printed boards.

(5)软性聚酯敷铜薄膜 是用聚酯薄膜与铜热压而成的带状材料，在应用中将它卷曲成螺旋形状放在设备内部。为了加固或防潮，常以环氧树脂将它灌注成一个整体。主要用作柔性印制电路和印制电缆，可作为接插件的过渡线。

(5) Soft polyester copper film is a ribbon material pressed with polyester film and copper thermally. of It curled into a spiral shape placed inside the device in real application. It is often injected into a whole with epoxy resin for reinforcement or moisture resistance. And It is mainly used as flexible printed circuit and printed cable which is the transition line of the connector.

要注意一点的是，同时在覆铜之前，首先加粗相应的电源连线：5.0V、3.3V等等，这样一来，就形成了多个不同形状的多变型结构。

One thing to be aware of is that the power corresponding connection should be thickened: 5.0V, 3.3V and so on before the copper cover, so that multi-variable structure with different shapes can be formed.